ABSTRACT
Multichip module (MCM) technology allows bare integrated circuits and passive devices to be mounted together on a common interconnecting substrate. An example is shown in Fig. 13.1. In this photograph, eight chips are wire-bonded onto an MCM. MCM technology, however, is not just about packaging chips together; it can lead to new capabilities and unique performance and cost advantages. The purposes of this chapter are as follows: to explain the different multichip module technologies, to show how MCMs can be employed to improve the price/performance of systems, and to indicate some of the more important issues in MCM-system design. Eight chips wire-bonded into an MCM. https://s3-euw1-ap-pe-df-pch-content-public-u.s3.eu-west-1.amazonaws.com/9781315220482/58874d52-9fb3-42c4-9c16-306fdd7077ec/content/fig13_1.jpg"/> (Source: MicroModule Systems.)
